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Numéro de sérieDS8024
CategorieCommunication => Security & Smart Card
DescriptionSmart Card Interface
The DS8024 smart card interface IC is a low-cost, analog front-end for a smart card reader, designed for all ISO 7816, EMV*, and GSM11-11 applications. The DS8024 is a pin-for-pin drop-in replacement for the NXP TDA8024 and is offered in 28-pin TSSOP and SO packages.
SociétéMaxim Integrated Products
DatasheetTélécharger DS8024 datasheet
 
 
  • Description courte

  • The DS8024 smart card interface is a low-cost, analog front-end for a smart card reader, designed for all ISO 7816, EMV*, and GSM11-11 applications. The is a pin-for-pin drop-in replacement for the NXP TDA8024 and is offered in 28-pin TSSOP and SO packages. Applications requiring support for 1.8V smart cards or requiring low power should consider the DS8113, which achieves lower active- and stop-mode power with minimal changes to application hardware and software.

    Features

    Analog Interface and Level Shifting for IC Card Communication 8kV (min) ESD (IEC) Protection on Card Interfaces Internal IC Card Supply-Voltage Generation: ±5%, 80mA (max) ±8%, 65mA (max) Automatic Card Activation and Deactivation Controlled by Dedicated Internal Sequencer I/O Lines from Host Directly Level Shifted for Smart Card Communication Flexible Card Clock Generation, Supporting External Crystal Frequency Divided or 8 High-Current, Short-Circuit and High-Temperature Protection

    Applications

    Set-Top Box Conditional Access Control Banking Applications POS Terminals Debit/Credit Payment Terminals PIN Pads Automated Teller Machines Telecommunications Pay/Premium Television

    Note: Contact the factory for availability of other variants and package options. +Denotes a lead-free/RoHS-compliant package.

    *EMV is a trademark owned by EMVCo LLC. EMV Level 1 library and hardware reference design available. Contact factory for details.

    Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device may be simultaneously available through various sales channels. For information about device errata, go to: www.maxim-ic.com/errata.

    For pricing, delivery, and ordering information, please contact Maxim Direct 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.

    Voltage Range on VDD Relative to +6.5V Voltage Range on VDDA Relative to +6.5V Voltage Range CP1, CP2, and VUP Relative to +7.5V Voltage Range on All Other Pins Relative GND......................................-0.5V to (VDD + 0.5V) Maximum Junction Temperature.....................................+125°C Maximum Power Dissipation (TA to +85°C).......700mW Storage Temperature to +150°C Soldering Temperature.........Refer to the IPC/JEDEC J-STD-020 Specification.

    Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

    (VDD = +3.3V, VDDA = +25°C, unless otherwise noted.) (Note 1)

    PARAMETER POWER SUPPLY Digital Supply Voltage Card Voltage-Generator Supply Voltage Reset Voltage Thresholds CURRENT CONSUMPTION Active VDD Current 5V Cards (Including 80mA Draw from 5V Card) Active VDD Current 5V Cards (Current Consumed by DS8024 Only) Active VDD Current 3V Cards (Including 65mA Draw from 3V Card) Active VDD Current 3V Cards (Current Consumed by DS8024 Only) Inactive-Mode Current CLOCK SOURCE Crystal Frequency fXTAL fXTAL1 XTAL1 Operating Conditions VIL_XTAL1 VIH_XTAL1 External Capacitance for Crystal Internal Oscillator SHUTDOWN TEMPERATURE Shutdown Temperature TSD (Note CXTAL1, CXTAL2 fINT Low-level input on XTAL1 (Note 3) High-level input on XTAL1 (Note 3) (Note 3) 2.7 External crystal x VDD 0.3 x VDD 15 pF MHz IDD_50V IDD_IC IDD_30V IDD_IC IDD ICC = 80mA, fXTAL = 20MHz, fCLK = 10MHz, VDDA = 5.0V ICC = 80mA, fXTAL = 20MHz, fCLK = 10MHz, VDDA = 5.0V (Note 2) ICC = 65mA, fXTAL = 20MHz, fCLK = 10MHz, VDDA = 5.0V ICC = 65mA, fXTAL = 20MHz, fCLK = 10MHz, VDDA = 5.0V (Note 2) Card inactive mA A VDD VDDA VTH2 VHYS2 VCC = 5V, |ICC| < 80mA VCC = 5V, |ICC| < 30mA Threshold voltage (falling) Hysteresis V mV SYMBOL CONDITIONS MIN TYP MAX UNITS

    (VDD = +3.3V, VDDA = +25°C, unless otherwise noted.) (Note 1)

    PARAMETER RST PIN Card-Inactive Mode Output Low Voltage Output Current Output Low Voltage Output High Voltage Rise Time Card-Active Mode Fall Time Shutdown Current Threshold Current Limitation RSTIN to RST Delay CLK PIN Card-Inactive Mode Output Low Voltage Output Current Output Low Voltage Output High Voltage Rise Time Card-Active Mode Fall Time Current Limitation Clock Frequency Duty Factor Slew Rate VCC PIN Card-Inactive Mode Output Low Voltage Output Current VCC1 ICC1 ICC = 1mA VCC < 65mA Output Low Voltage VCC2 5V card: current pulses of 40nC with < 20MHz (Note 3) 3V card: current pulses of 24nC with < 20MHz (Note 3) Output Current Shutdown Current Threshold Slew Rate ICC2 ICC(SD) VCCSR Up/down, VOL_CLK2 VOH_CLK2 tR_CLK tF_CLK ICLK(LIMIT) fCLK SR Operational (Note = 30pF (Note = 30pF (Note 3) IOLCLK = 1mA VOLCLK = 0V IOLCLK = 200A IOHCLK = 30pF (Note = 30pF (Note VCC ns mA MHz % V/ns VOL_RST2 VOH_RST2 tR_RST tF_RST IRST(SD) IRST(LIMIT) tD(RSTIN-RST) -20 IOL_RST = 1mA VO_LRST = 0V IOL_RST = 200A IOH_RST = 30pF (Note = 30pF (Note VCC mA s SYMBOL CONDITIONS MIN TYP MAX UNITS