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Numéro de sérieFDMF6704A
CategorieDiscrete => Transistors => FETs (Field Effect Transistors) => MOSFETs => Power MOSFETs
DescriptionThe Xtra Small High Performance, High Frequency DrMOS Module
The XS™ DrMOS family is Fairchild’s next-generation fullyoptimized ultra-compact integrated MOSFET plus driver power stage solution for high current, high frequency synchronous buck DC-DC applications. The FDMF6704A DrMOS integrates a driver IC, two power MOSFETs and a bootstrap Schottky diode into a thermally enhanced compact 6 mm x 6 mm MLP package. With an integrated approach, the complete switching power stage is optimized with regards to driver and MOSFET dynamic performance, system inductance and RDS(ON). This greatly reduces the package parasitics and layout challenges associated with conventional discrete solutions. The driver IC incorporates advanced features such as SMOD. A 5 V gate drive and an improved PCB interface [Low Side MOSFET exposed pad] ensure higher performance. This product meets the Intel 6 mm x 6 mm DrMOS pinout.
SociétéFairchild Semiconductor
DatasheetTélécharger FDMF6704A datasheet
 
 
  • Description courte
  • FDMF6704A High Frequency, High Efficiency, Ultra Compact DrMOS Module

    Ultra compact size 6 mm MLP, 44 % space saving compared to conventional MLP 8 mm DrMOS packages. Fully optimized system efficiency. Clean voltage waveforms with reduced ringing. High frequency operation.

    The Xtra Small High Performance, High Frequency DrMOS Module

    The XSTM DrMOS family is Fairchild's next-generation fullyoptimized ultra-compact integrated MOSFET plus driver power stage solution for high current, high frequency synchronous buck DC-DC applications. The FDMF6704A DrMOS integrates a driver IC, two power MOSFETs and a bootstrap Schottky diode into a thermally enhanced compact 6 mm MLP package. With an integrated approach, the complete switching power stage is optimized with regards to driver and MOSFET dynamic performance, system inductance and RDS(ON). This greatly reduces the package parasitics and layout challenges associated with conventional discrete solutions. The driver IC incorporates advanced features such as SMOD. 5 V gate drive and an improved PCB interface [Low Side MOSFET exposed pad] ensure higher performance. This product meets the Intel 6 mm DrMOS pinout.

    Features

    Ultra- compact thermally enhanced 6 mm MLP package 84 % smaller than conventional discrete solutions. Synchronous driver plus FET multichip module. High current handling 35 A. Over 93 % peak efficiency. Logic level PWM input. Fairchild's PowerTrench® 5 technology MOSFETs for clean voltage waveforms and reduced ringing. Optimized for high switching frequencies to 1 MHz. Skip mode SMOD [low side gate turn off] input. Fairchild SyncFETTM [integrated Schottky diode] technology in the low side MOSFET. Integrated bootstrap Schottky diode. Adaptive gate drive timing for shoot-through protection. Driver output disable function [DISB# pin]. Undervoltage lockout (UVLO). Fairchild Green Packaging and RoHS compliant. Low profile SMD package.

    Applications

    Compact blade servers V-core, non V-core and VTT DC-DC converters. Desktop computers V-core, non V-core and VTT DC-DC converters. Workstations V-core, non V-core and VTT DC-DC converters. Gaming Motherboards V-core, non V-core and VTT DC-DC converters. Gaming consoles. High-current DC-DC Point of Load (POL) converters. Networking and telecom microprocessor voltage regulators. Small form factor voltage regulator modules.

    5V CVDRV VDRV VCIN DISB# PWM Input OFF ON DISB# PWM SMOD# CGND CVCIN 12 V CVIN VIN BOOT PHASE VSWH PGND COUT CBOOT OUTPUT

    SMOD# VCIN VDRV BOOT CGND HDRV PHASE NC VIN 1 10
    SMOD# VCIN VDRV BOOT CGND HDRV PHASE NC VIN VSWH PGND LDRV DISB# PWM

    When SMOD# = HI, low side driver is inverse of PWM input. When SMOD# = Low, low side driver is disabled. IC bias supply. Minimum 1 F ceramic capacitor is recommended from this pin to CGND. Power for low side driver. Minimum 1 F ceramic capacitor is recommended to be connected as close as possible from this pin to CGND. Bootstrap supply input. Provides voltage supply to high-side MOSFET driver. Connect bootstrap capacitor from this pin to PHASE. IC ground. Ground return for driver IC. For manufacturing test only. This pin must be floated. Must not be connected to any pin. Switch node pin for easy bootstrap capacitor routing. Electrically shorted to VSWH pin. No connect. Power input. Output stage supply voltage. Switch node input. Provides return for high-side bootstrapped driver and acts as a sense point for the adaptive shoot-thru protection. Power ground. Output stage ground. Source pin of low side MOSFET(s). For manufacturing test only. This pin must be floated. Must not be connected to any pin. Output Disable. When low, this pin disable FET switching (HDRV and LDRV are held low). PWM Signal Input. This pin accepts a logic-level PWM signal from the controller.

    VCIN, VDRV, DISB#, PWM, SMOD#, LDRV to CGND VIN to PGND, CGND BOOT, HDRV to VSWH BOOT, VSWH, HDRV to GND BOOT to VDRV IO(AV) IO(peak) RJPCB Junction to PCB Thermal Resistance -55 Operating and Storage Junction Temperature Range VIN 1.3 V fSW = 350 kHz fSW = 1 MHz

    VCIN VIN Control Circuit Supply Voltage Output Stage Supply Voltage