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Numéro de sérieEMIF02-SPK02F2
CategoriePower Management => Protection and Isolation
DescriptionEMI Filtering & Signal Conditioning
2-line IPAD\", EMIF filter and ESD protection
SociétéST Microelectronics, Inc.
DatasheetTélécharger EMIF02-SPK02F2 datasheet
 
 
  • Description courte
  • Features

    Lead free package Very low resistance: 0.35 High attenuation: at 900 MHz Very low PCB space consumption: 1.26 mm Very thin package: 0.65 mm High efficiency in ESD suppression IEC6 1000-4-2 level 4 High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging

    Application
    Description

    The EMIF02-SPK02F2 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering. The EMIF02-SPK02F2 Flip-Chip packaging means the package size is equal to the die size. That's why the is a very small device. Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 30 kV. Figure 2.

    Parameter ESD discharge IEC 61000-4-2 Air discharge Contact discharge Maximum rms currrent per channel Junction temperature range Storage temperature range Value Unit

    Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Symbol VBR IRM RI/O Cline fc

    Parameters Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Series resistance between input and output Input capacitance per line Test conditions 1 mA VRM 0 V DC, 1 MHz Cut-off frequency: ZSOURCE = ZLOAD Min Typ Max Unit nA pF MHz

    ESD response to IEC 61000-4-2 Figure (+15 kV air discharge) on one input V(in) and on one output V(out)

    ESD response to IEC (-15 kV air discharge) on one input V(in) and on one output V(out)